日月光先进封装报价再度上调20%

日月光先进封装报价再度上调20%

2026-07-01 20:47View Original

ChainThink 消息，7 月 1 日，据业界消息，日月光先进封装报价再度上调逾 20%，涵盖 CoWoS、FoCoS 等先进封装，并涉及一线美系大客户。

此次调价背景包括 AI 应用带动半导体需求走强、先进封装产能持续紧俏，以及原材料和长期投资成本上升。当前龙头及中小型封测厂稼动率几乎维持满载，市场预期其他封测厂或将跟进调价。

据公开表态，日月光营运长吴田玉此前表示，涨价主要反映原材料价格上涨及投资成本增加。其资本支出已由过去每年约 20 亿美元提升至去年 53 亿美元、今年 85 亿美元，未来仍不排除继续上调。

Disclaimer: Contains third-party opinions, does not constitute financial advice

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