AMD与三星就HBM4大规模供应合同接近完成，Helios预计第三季度末出货

2026-07-24 17:00

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ChainThink 消息，7 月 24 日，据《首尔经济日报》报道，AMD CEO 苏姿丰表示，AMD 与三星电子就 HBM4 大规模供应签署正式合同的谈判已“接近完成”。

今年 3 月，双方已签署合作备忘录，内容包括三星优先向 AMD 新一代 AI 加速器供应 HBM4，并推进晶圆代工合作。

苏姿丰在“AMD Advancing AI 2026”上表示，AI 服务器机架系统 Helios 已进入全面量产阶段，预计从第三季度末开始出货。

随着 Helios 投产，AMD 正与三星讨论进一步扩大 HBM4 供应的具体合同。

三星电子晶圆代工业务负责人 Han Jin-man 及美洲半导体业务负责人 Cho Sang-yeon 出席活动，并在演讲结束后与 AMD CTO Joseph Macri 等高管继续会谈。

Macri 在被问及 HBM 后续供应及 AMD 芯片由三星代工的可能性时，仅表示双方保持“合作关系”。

Disclaimer: Contains third-party opinions, does not constitute financial advice

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