摩根士丹利：半导体景气周期远未结束，2027云资本开支或冲上1.3万亿美元

摩根士丹利：半导体景气周期远未结束，2027云资本开支或冲上1.3万亿美元

2026-08-01 18:14

据摩根士丹利 7 月 31 日发布的大中华区半导体报告，AI 半导体仍处于高景气周期，需求正从 GPU 扩散至先进制程、先进封装、内存、测试设备、ASIC 及中国 AI 芯片产业链。

报告预计，2026 年云端 AI 半导体市场规模可能达到 4850 亿美元，2030 年进一步扩大至约 7530 亿美元；全球半导体市场到 2030 年有望达到 1.5 万亿美元。

摩根士丹利称，按其云资本开支跟踪模型，全球前 14 家上市云服务商 2027 年云资本开支可能接近 1.3 万亿美元，且未包含主权 AI 项目。

Disclaimer: Contains third-party opinions, does not constitute financial advice

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