ChainThink 消息,8 月 5 日,据行情数据,日经 225 指数开盘上涨,现涨 3.12%;日股铠侠涨 6.6%。
消息面上,铠侠与闪迪在 Future of Memory and Storage Conference(FMS)上发布 BiCS10 3D QLC NAND 闪存芯片,称其为目前全球已正式推出的最高存储密度 3D NAND 产品。
据介绍,该芯片采用 332 层堆叠结构,单位面积存储密度达 37 Gb/mm²,搭载最高 4800 MT/s 高速接口,并支持独立命令地址(SCA)功能,主要面向高容量数据中心级 SSD 市场。
相比此前 BiCS10 3D TLC NAND 产品超过 29 Gb/mm² 的存储密度,新款 QLC NAND 进一步提高数据中心存储容量密度。
业内预计,在相近芯片尺寸和存储单元数量下,该芯片容量可能约为 1.33Tb,但厂商尚未公布具体容量规格。
Disclaimer: Contains third-party opinions, does not constitute financial advice
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