ChainThink 消息,9 月 7 日,据韩国半导体媒体《The Elec》报道,三星电子正使用美国 FormFactor 与台湾 MPI 的探针台,对硅光子集成电路(PIC)晶圆进行测试,计划在今年内完成 PIC 自主评估。
报道称,两家公司均已通过台积电 CPO 及硅光子测试相关设备验证,三星此次采用与台积电相同的测试基础设施,对 PIC 晶圆进行波长域、频率域等光电特性测试,以验证光器件是否实现光信号传输及电光转换。
三星此前曾委托比利时 imec 等外部机构进行 PIC 晶圆验证,现正搭建自主测试环境并开展重复评估。
公司已表示从今年下半年开始相关项目量产,并计划于 2027 年启动硅光子代工服务,后续将 CPO 应用从网络交换机扩展至 GPU、CPU 等产品。
Disclaimer: Contains third-party opinions, does not constitute financial advice
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