ChainThink News: According to The Information, two sources familiar with the matter indicate that TSMC is considering entering the advanced memory chip manufacturing sector and has already begun planning production of 3D DRAM to meet NVIDIA's demands.

3D DRAM enhances storage capacity by vertically stacking memory cells, differing from traditional DRAM that places memory cells on a single layer. Currently, Samsung Electronics, SK Hynix, and Micron dominate memory chip manufacturing and are all developing 3D DRAM technology.

The surge in AI hardware demand has intensified supply constraints and driven up prices for memory chips, prompting chip design firms such as NVIDIA and Apple to seek additional supply sources. Apple earlier this year raised device pricing due to rising memory costs.