ChainThink消息,8月10日,据The Information报道,微软自研人工智能芯片项目在起步缓慢后出现复苏迹象,计划大幅提升 MAIA 芯片产量,并加大内部使用力度。
微软认为,MAIA 芯片可更低成本运行公司自研模型及 OpenAI 的模型,同时也在积极争取大客户。据悉,微软计划于 2026 年 9 月发布下一代 MAIA 300 人工智能芯片。
此外,微软一直在与台积电洽谈,以确保获得超过 30 万颗 MAIA 芯片的生产能力,并计划于 2027 年交付。
Disclaimer: Contains third-party opinions, does not constitute financial advice
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